Intel Opens Fab 9 in New Mexico

Intel opened a Fab 9 factory in Rio Rancho, New Mexico. The milestone is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including 3D packaging technology, Foveros, which offers flexible options for combining multiple chips that are optimized for power, performance, and cost.

“Today, we celebrate the opening of Intel’s first high-volume semiconductor operations and the only U.S. factory producing the world’s most advanced packaging solutions at scale. This cutting-edge technology sets Intel apart and gives our customers real advantages in performance, form factor, and flexibility in design applications, all within a resilient supply chain. Congratulations to the New Mexico team, the entire Intel family, our suppliers, and contractor partners who collaborate and relentlessly push the boundaries of packaging innovation,” said Keyvan Esfarjani, Intel executive vice president and chief global operations officer.

The Fab 9 and Fab 11x facilities in Rio Rancho represent the first operational site for mass production of Intel’s 3D advanced packaging technology. It is also the company's first co-located high-volume advanced packaging site, marking an end-to-end manufacturing process that creates a more efficient supply chain from demand to final product.